Custom TGV Glass Substrates | Through-Glass Via Solutions Provider

TGV glass substrates are advanced interconnection materials that involve forming vertical through-holes (vias) directly in a glass wafer or panel. These substrates are crucial components in cutting-edge electronic and microelectronic packaging applications, especially in 3D integration, MEMS devices, RF modules, optoelectronic interconnects, microfluidics, and biosensors.